Shuttle XPC | PC Made Modern

Casual Gaming

Performance Gaming

Extreme Gaming

Made for modern games and applications, Shuttle’s casual gaming PCs deliver all the graphics power and processing speed you need to play the popular games of today – the way they’re meant to be played. With a GeForce® graphics card, Shuttle’s casual gaming PCs offer spectacular video, gorgeous graphics, and a premium Windows® 7 experience.

Equipped with more powerful graphics and faster processors, Shuttle’s performance gaming PCs take high-res graphics and supercharged performance to another level. With a GeForce® graphics card that delivers killer performance, Shuttle’s performance gaming PCs arm you with everything you need spoil your senses – and dominate the competition.

With screaming performance like never before, Shuttle’s extreme gaming PCs can rip through the games of today and tomorrow. With a GeForce® graphics card that delivers the ultimate best in performance, Shuttle’s extreme gaming PCs crank up the gaming realism, and breaks through the boundaries of your screen with 3D capability.

Models

Since we first unveiled the concept of small form factor extreme gaming PC, many people have asked how and why in such a small case, and the answer is simple. After looking more into what users wanted and needed we here at Shuttle started to talk about some of the cool things we were working on, at home including liquid cooling, silent systems, extreme performance rigs, molding, etc.. This made us realize why not use our already great performance models and crank up the juice a little.

Being extreme gamers ourselves, we knew we had to go back to the drawing board to create the maximum gaming experience in a small form factor. This led to a very interesting design experience in the virtues of restraint in product development. We knew there were going to be challenges, but grew to understand what it was gamers really needed. We then understood that it wasn’t about the latest and greatest technologies, but more about the tuning behind it.

Now after several years of creating innovations, we have released our complete line of gaming solutions, created for gamers by gamers.

Behind the Scenes

Shuttle Gaming Lab
You won’t find any design secrets here but, we will give you a look into the creativity at work behind everything from motherboard design, cooling, to custom paint as these are the key instruments that take part in the creation of Shuttle's elite gaming rigs.

Here at SGL the people who re-examine, re-evaluate and re-invent our manufacturing environment continue do so on a daily basis to bring to you fresh and innovative ideas.

Hardware Creation
Our Hardware is created and tested for limits-pushing possibilities. We have a dedicated team pushing the limits on each piece of hardware to insure the best quality and performance from our small form factor systems. Our team of experts are always researching and finding new ideas to develop the best small form factor systems out in the market that fits each users needs.

Performance Tuning
While, our systems are tuned for ultimate performance out of the box, we take it to a whole new level by overclocking some of the hardware to push the system beyond its limits. Apart from overclocking, we do a few behind the scenes tuning to the BIOS, allowing us to go beyond the average system builder and show you our true manufacturer programming skills.

I.C.E Heat-Pipe Cooling Technology

I.C.E Heat-pipe Technology
The Integrated Cooling Engine (I.C.E.) included in the Shuttle systems has been purposely designed for each model. The Integrated Cooling Engine uses convection cooling to transfer heat away from the processor and other critical system components. Copper tubing, coated in nickel and filled with distilled water provides the conduit through which heat the radiator, providing both processor cooling and passes to a radiator.

Those familiar with the XPC will notice that the I.C.E. module has evolved and the airflow has been redirected to improve overall performance thru-out the system. A fan duct channels the intake airflow to ensure cool air is used to cool the CPU and a foam duct on the case makes sure the exhaust directly exits the case without warming other components.

Liquid I.C.E. Cooling Technology
For Shuttle SG45H7 and SP45H7 Chassis ONLY
Since we unveiled our first ever I.C.E. Cooling solution back in 2000, many have asked where the design came from, what were we thinking when we created it, and why did we wait so long in launching it? And the truth is, there are many reasons: a combination of performance concerns, acoustic concerns, technology changes, and our thermal team's goal to create the best thermal solution in a small form factor. Now with our new addition to the I.C.E. Cooling family, the new Liquid I.C.E. Cooling system, we are being asked the same questions. The truth is, this idea has gone through major changes since its first introduction in 2007 as a concept and it has come a long way since then.

CPU Block
Unlike most water blocks, the Shuttle Liquid I.C.E. Is incredibly easy to install in to our Shuttle LGA775 socket barebones. There's no messing about with bolts, washers, sprockets, spring-loaded screws or other plumbing paraphernalia. Instead, the Liquid I.C.E. Cooling unit screws directly into the rear 92mm plate as a conventional fan might do.
Radiator
This is a ground-up custom design 92mm radiator that gives Shuttle systems excellent performance while keeping the size small and allowing for a very easily accessible fill port. When comparing the performance of our Liquid I.C.E. To some of the giant heat pipe solutions, it becomes a simple surface area trade off. We consciously chose to keep the size of the radiator at a minimum to increase the compatibility with many H7 chassis models and of course minimize the surface area that is being mounted on the CPU.
Reliability
The liquid I.C.E. cooling system has gone through major changes since its first introduction in 2007 as a concept and it has come a long way since then. The bottom line is that we wanted to provide a product that can be used easily, to suit the taste of the individual that is using it. It is exactly the reason why we have designed this cooling solution not only to fit a single model but it will be supported on both SG45H7 and SP45H7.

OASIS Cooling Technology
Within the best performing platform is the top performance cooler, the newly designed Shuttle OASIS Cooling Technology delivers just that. Specially designed 3-part heat-sinks interconnected by convection cooling pipes covering the North Bridge, South Bridge and MOSFET modules effectively dissipate heat without the use for fans. Featuring all-new heat pipe designs, Shuttle OASIS allows users to enjoy longer component lifetime through lower temperatures and added system stability all in a silent operational environment.